Through-hole resin-filled substrate
Through-hole resin-filled substrate
This is a method of placing through vias on the pads of electronic components and filling the vias with paste to eliminate issues during the mounting of electronic components. It is effective in high-density designs and may be less expensive than IVH or build methods. It is used for narrow-pitch BGAs and similar components.
- Company：アーセルデザイン
- Price：Other
